Our seals are suitable for applications within semiconductor processes including plasma, deposition, thermal and wet applications. These processes present harsh plasma and gas environments, often at extreme temperatures.
– Dry/Wet Etch
– Plasma
– Chemical vapor deposition (CVD)
– Physical vapor deposition (PVD)
– Sub-Fab
– Wet Clean
We have a range of Ultra High Purity (UHP) elastomer compounds suitable for applications where minimal particle generation and outgassing (even at elevated temperatures) are critical. These include a range of UHP perfluoroelastomer materials. We can develop our base elastomer materials to meet particular cleanliness, purity, outgassing or extreme chemical resistance and temperature requirements to suit all plasma, etching and deposition processes.
Our materials are fully compliant with USP Class VI, ISO 10993, UHP, BAM and BfR standards. We can review and recommend material grades for each individual application in order to minimise degradation and to provide maximum seal service life in your application.
Our ISO13485:2016 clean room manufacturing facilities are Class 7 (10,000) manufacturing, and Class 5 (100) inspection, cleaning, & packaging.
