Manufacturing in accordance with ISO9001:2015, ISO 14001:2015, IATF16949:2016 and ISO13485
Clean room manufacturing Class 7 (10,000) and inspection, cleaning & packaging Class 5 (100)
Ultra High Purity elastomers with low permeation and outgassing
Materials suitable for the most aggressive chemical media and at high temperatures
Application conditions within semiconductor manufacturing processes are some of the harshest known in industry.
Our engineered sealing solutions come into contact with the most aggressive chemical media including alkaline, acids, solvents and gases and are often required to perform at extreme temperatures of 300°C and above.
We have a range of seal products suitable for applications within the following semiconductor manufacturing processes;
- Dry/Wet Etching
- Plasma Systems
- Chemical vapor deposition (CVD)
- Atomic layer deposition (ALD)
- Physical vapor deposition (PVD)
We have a range of Ultra High Purity (UHP) elastomer compounds suitable for applications where minimal particle generation and outgassing (even at elevated temperatures) are critical. These include a range of UHP perfluoroleastomer materials.
We have materials that are fully compliant with USP Class VI, ISO 10993, UHP, BAM and BfR standards, and our materials engineers can review and recommend material grades for each individual application in order to minimise degradation and to provide maximum service life in application.
Our clean room manufacturing facilities are Class 7 (10,000) manufacturing and Class 5 (100) inspection, cleaning, & packaging.
Our application engineers utilise the latest in 2D/3D CAD and FEA simulation software to design and replicate seal performance before finalising each individual seal design, incorporating significant feature and critical function elements for integration with customer mating parts.